Within the project, your main tasks will include: Placing electronic components (ICs, resistors, capacitors, connectors, etc.) Routing signal, power, and ground traces Managing multilayer stack-ups Ensuring signal integrity, EMC/EMI, thermal performance, and reliability Applying design rules and manufacturing constraints (DFM, DFA, DFT) Preparing manufacturing files (Gerbers, ODB++, pick-and-place, BOM)
Desired Candidate Profile
- With a Master s degree (BAC+5) from an engineering school or university specializing in embedded systems, you have a 1st successful experience in the field of electronics, HW engineer or physical layout of PCBs.
- Strong understanding of electronics and schematics
- Knowledge of PCB manufacturing processes
- IPC standards knowledge (IPC 2221, IPC 7351, IPC A 610 is a plus)
- Signal integrity and power integrity basics
- Attention to detail and precision
- Ability to read datasheets and application notes
- Problem-solving and cross-team communication