Within the project, your main tasks will include: Placing electronic components (ICs, resistors, capacitors, connectors, etc.) Routing signal, power, and ground traces Managing multilayer stack-ups Ensuring signal integrity, EMC/EMI, thermal performance, and reliability Applying design rules and manufacturing constraints (DFM, DFA, DFT) Preparing manufacturing files (Gerbers, ODB++, pick-and-place, BOM)
Desired Candidate Profile
With a Master s degree (BAC+5) from an engineering school or university specializing in embedded systems, you have a 1st successful experience in the field of electronics, HW engineer or physical layout of PCBs. Strong understanding of electronics and schematics Knowledge of PCB manufacturing processes IPC standards knowledge (IPC 2221, IPC 7351, IPC A 610 is a plus) Signal integrity and power integrity basics Attention to detail and precision Ability to read datasheets and application notes Problem-solving and cross-team communication